Incentives for semiconductor and display projects.
The headline semiconductor packages are written for fabrication at a scale very few applicants reach. Most of what an assembly, testing, packaging or component unit can actually claim sits in the state electronics and industrial policies underneath them. We tell you which of the two conversations you are in before anything is filed.
Fabrication or the supply chain
The two are assessed on different tests, and most applicants belong in the second. Saying so early saves months.
The state package carries it
For a unit below fabrication scale, the state electronics and industrial policies are where the money is.
Filed end to end
Project report, bank appraisal, the incentive application and the claims the policy schedules afterwards.
Semiconductor & Display Subsidy
Tell us the project. We come back with the schemes you qualify for.
Central schemes this sector applies under
Every figure, every deadline and the notification behind it are on the scheme’s own page.
- ECMS — Electronics Components ManufacturingThe central scheme for component manufacturing.
- Production Linked Incentive — overviewWhere output is large enough for a production-linked claim.
- RAMP — Raising and Accelerating MSME PerformanceFor the capability and market-access side of the business.
- Credit Guarantee Scheme for StartupsThe guarantee route where there is no collateral.
State policies that cover it
Where the unit is registered decides most of what it can claim. These are the policies we work with; if your state is not here, ask — the list grows as the policies are read.
Not sure which of these your project qualifies for?
Send the project details and we come back with the shortlist, in the order they have to be applied in.